     1.4軍用衛星系統的發展    大(da)中型非球面(mian)曲面(mian)超精密加工(gong)設(she)備及(ji)工(gong)藝研究 非軸對稱光(guang)學曲(qu)面加(jia)工設(she)備的研制(五(wu)軸CNC超精密加(jia)工中心)  非球面曲(qu)面超精密檢測技術研究 非(fei)球(qiu)面(mian)(mian)(mian)檢(jian)測技(ji)術是光(guang)學(xue)非(fei)球(qiu)面(mian)(mian)(mian)加工首先要解(jie)決(jue)的關鍵問題(ti)，特別是針對(dui)(dui)我(wo)國的國情，至少在目(mu)前還只能(neng)靠人工輔助(zhu)研(yan)磨加工光(guang)學(xue)非(fei)球(qiu)面(mian)(mian)(mian)，測量問題(ti)顯得(de)更為突出。只有(you)準確、快速測量出加工過程中零(ling)(ling)件的誤差，工人才有(you)可能(neng)相應研(yan)磨從而(er)獲得(de)高精(jing)度(du)的非(fei)球(qiu)面(mian)(mian)(mian)光(guang)學(xue)零(ling)(ling)件。相對(dui)(dui)于非(fei)球(qiu)面(mian)(mian)(mian)加工技(ji)術來說，其測量技(ji)術與(yu)國外相比落后(hou)更多。光(guang)學(xue)非(fei)球(qiu)面(mian)(mian)(mian)檢(jian)測技(ji)術應當具(ju)備能(neng)在鏡面(mian)(mian)(mian)加工過程中迅速判斷(duan)面(mian)(mian)(mian)型誤差狀況，隨機反饋給出進一步修正指令，又要解(jie)決(jue)零(ling)(ling)件的終了檢(jian)驗。 目前非球(qiu)面面型測(ce)(ce)量(liang)應用最多的方法是(shi)光波的干涉(she)測(ce)(ce)量(liang)法，具有較高的測(ce)(ce)量(liang)精(jing)度和較好的空間分辨(bian)率(lv)。它(ta)可以快速進(jin)行整(zheng)個表面的測(ce)(ce)量(liang)，最高分辨(bian)率(lv)可達到(dao)亞納米級。但是(shi)對(dui)于不同的光學非球(qiu)面，必須(xu)準備相應的光學模板才能(neng)進(jin)行測(ce)(ce)量(liang)，這(zhe)套測(ce)(ce)量(liang)系統(tong)通常結構非常復雜(za)。 利用(yong)(yong)全(quan)(quan)息(xi)(xi)(xi)干涉(she)法可(ke)以測量(liang)(liang)非球(qiu)面(mian)，但是無論是采(cai)用(yong)(yong)標準(zhun)非球(qiu)面(mian)還(huan)是采(cai)用(yong)(yong)計算機生成(cheng)(CGH)都必須(xu)制作一(yi)張(zhang)全(quan)(quan)息(xi)(xi)(xi)片，而(er)且(qie)對(dui)于(yu)(yu)不同方程的(de)非球(qiu)面(mian)就必須(xu)有相應的(de)全(quan)(quan)息(xi)(xi)(xi)片。但是直(zhi)到目(mu)前(qian)為止國內制作全(quan)(quan)息(xi)(xi)(xi)片的(de)工藝(yi)還(huan)只局限于(yu)(yu)一(yi)些傳統的(de)工藝(yi)，對(dui)于(yu)(yu)非球(qiu)面(mian)超精(jing)密測量(liang)(liang)所(suo)(suo)需的(de)全(quan)(quan)息(xi)(xi)(xi)片基本上依(yi)賴于(yu)(yu)進口(kou)，這極大(da)(da)(da)地限制了光學非球(qiu)面(mian)零件的(de)測試(shi)及加(jia)工。目(mu)前(qian)進口(kou)一(yi)張(zhang)非球(qiu)面(mian)超精(jing)密測量(liang)(liang)用(yong)(yong)的(de)全(quan)(quan)息(xi)(xi)(xi)片大(da)(da)(da)約需要一(yi)萬(wan)多美(mei)金，而(er)且(qie)需要告訴對(dui)方非球(qiu)面(mian)的(de)方程，對(dui)于(yu)(yu)型號任務這就牽涉(she)到保密等(deng)問題。特別(bie)是對(dui)于(yu)(yu)一(yi)些預(yu)研(yan)或(huo)在研(yan)以及沒有定型的(de)項目(mu)，由于(yu)(yu)牽涉(she)到非球(qiu)面(mian)的(de)種類和(he)數量(liang)(liang)較大(da)(da)(da)，所(suo)(suo)需經(jing)費(fei)十分可(ke)觀，所(suo)(suo)以自行研(yan)制非球(qiu)面(mian)測量(liang)(liang)用(yong)(yong)的(de)全(quan)(quan)息(xi)(xi)(xi)片已(yi)經(jing)成(cheng)為當務之急。 高精度(du)激光刻劃系統主要包括以下幾(ji)個方面:
非(fei)硅材料三(san)維微小型零(ling)件(jian)超精密加工技術的研究(jiu) MEMS加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)技(ji)術主要(yao)有從半導(dao)體(ti)加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)工(gong)(gong)(gong)(gong)藝(yi)中發展起來(lai)的硅平(ping)面工(gong)(gong)(gong)(gong)藝(yi)和(he)體(ti)硅工(gong)(gong)(gong)(gong)藝(yi)。八(ba)十(shi)年代(dai)中期以后利用(yong)X射(she)線光刻、電鑄、及注塑(su)的LIGA技(ji)術誕生，形成(cheng)了 MEMS加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)的另一個(ge)體(ti)系。MEMS的加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)技(ji)術可包(bao)括硅表面加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)和(he)體(ti)加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)的硅微(wei)細(xi)加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)、LIGA加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)和(he)利用(yong)紫(zi)外光刻的準(zhun)LIGA加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)、微(wei)細(xi)電火花加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)(EDM)、超(chao)聲波加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)、等離(li)子(zi)體(ti)加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)、激(ji)光加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)、離(li)子(zi)束(shu)加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)、電子(zi)束(shu)加(jia)(jia)(jia)(jia)(jia)工(gong)(gong)(gong)(gong)、立體(ti)光刻成(cheng)形等。 但(dan)是構成(cheng)這(zhe)些(xie)微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)械(xie)的(de)(de)(de)(de)(de)零件是各(ge)種(zhong)各(ge)樣而紛繁復(fu)雜的(de)(de)(de)(de)(de)，要想使微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)械(xie)性能真(zhen)正(zheng)(zheng)地過關并達到實(shi)用的(de)(de)(de)(de)(de)程度(du)，必須(xu)要盡快(kuai)地提高微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)械(xie)零件的(de)(de)(de)(de)(de)制(zhi)(zhi)造(zao)工(gong)藝(yi)(yi)與(yu)設(she)備(bei)的(de)(de)(de)(de)(de)水平。目前微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)械(xie)零件的(de)(de)(de)(de)(de)制(zhi)(zhi)造(zao)工(gong)藝(yi)(yi)最為(wei)成(cheng)熟的(de)(de)(de)(de)(de)技(ji)(ji)術就是光刻，許多(duo)經典(dian)(dian)的(de)(de)(de)(de)(de)微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)械(xie)零件制(zhi)(zhi)造(zao)的(de)(de)(de)(de)(de)成(cheng)果，基本上都是采用光刻或(huo)電鑄(zhu)技(ji)(ji)術完成(cheng)的(de)(de)(de)(de)(de)。然而這(zhe)些(xie)成(cheng)熟的(de)(de)(de)(de)(de)工(gong)藝(yi)(yi)方法(fa)所(suo)加(jia)工(gong)的(de)(de)(de)(de)(de)微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)械(xie)零件只(zhi)能是二維的(de)(de)(de)(de)(de)(或(huo)準三維)，而實(shi)際(ji)真(zhen)正(zheng)(zheng)的(de)(de)(de)(de)(de)三維形狀零件用光刻技(ji)(ji)術是完成(cheng)不了的(de)(de)(de)(de)(de)。在(zai)(zai)(zai)微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)械(xie)中，存(cun)在(zai)(zai)(zai)著(zhu)許多(duo)三維的(de)(de)(de)(de)(de)微(wei)(wei)(wei)小(xiao)(xiao)零件，如(ru)微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)模具、直徑(jing)(jing)為(wei)70μm的(de)(de)(de)(de)(de)微(wei)(wei)(wei)小(xiao)(xiao)螺紋、微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)齒條、直徑(jing)(jing)為(wei)50μm的(de)(de)(de)(de)(de)銷子、各(ge)段(duan)直徑(jing)(jing)分別為(wei)200μm、100μm、50μm的(de)(de)(de)(de)(de)階梯軸、外徑(jing)(jing)為(wei)300μm的(de)(de)(de)(de)(de)旋轉拋(pao)物(wu)面(mian)等(deng)(deng)，這(zhe)些(xie)典(dian)(dian)型(xing)(xing)(xing)(xing)(xing)(xing)的(de)(de)(de)(de)(de)三維微(wei)(wei)(wei)小(xiao)(xiao)零件的(de)(de)(de)(de)(de)加(jia)工(gong)，不僅用光刻、三束加(jia)工(gong)等(deng)(deng)工(gong)藝(yi)(yi)方法(fa)實(shi)現(xian)不了，用傳統(tong)(tong)的(de)(de)(de)(de)(de)機(ji)(ji)(ji)械(xie)制(zhi)(zhi)造(zao)系(xi)統(tong)(tong)也是不可能實(shi)現(xian)的(de)(de)(de)(de)(de)。因此，必須(xu)針對三維微(wei)(wei)(wei)小(xiao)(xiao)機(ji)(ji)(ji)器的(de)(de)(de)(de)(de)特點(dian)，開發和(he)(he)研制(zhi)(zhi)微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)制(zhi)(zhi)造(zao)系(xi)統(tong)(tong)，在(zai)(zai)(zai)這(zhe)種(zhong)新(xin)概(gai)念(nian)(nian)制(zhi)(zhi)造(zao)系(xi)統(tong)(tong)中實(shi)現(xian)微(wei)(wei)(wei)小(xiao)(xiao)機(ji)(ji)(ji)器零件的(de)(de)(de)(de)(de)加(jia)工(gong)、檢測(ce)和(he)(he)裝(zhuang)配。由(you)微(wei)(wei)(wei)小(xiao)(xiao)型(xing)(xing)(xing)(xing)(xing)(xing)設(she)備(bei)組成(cheng)的(de)(de)(de)(de)(de)制(zhi)(zhi)造(zao)微(wei)(wei)(wei)小(xiao)(xiao)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)器的(de)(de)(de)(de)(de)系(xi)統(tong)(tong)稱為(wei)微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)制(zhi)(zhi)造(zao)系(xi)統(tong)(tong)，其中技(ji)(ji)術難題包括微(wei)(wei)(wei)小(xiao)(xiao)型(xing)(xing)(xing)(xing)(xing)(xing)機(ji)(ji)(ji)器零件的(de)(de)(de)(de)(de)加(jia)工(gong)、檢測(ce)和(he)(he)裝(zhuang)配等(deng)(deng)，關于這(zhe)方面(mian)的(de)(de)(de)(de)(de)研究工(gong)作主要集(ji)中在(zai)(zai)(zai)日本和(he)(he)美國。日本在(zai)(zai)(zai)這(zhe)方面(mian)首(shou)先提出了微(wei)(wei)(wei)型(xing)(xing)(xing)(xing)(xing)(xing)桌(zhuo)面(mian)工(gong)廠(chang)的(de)(de)(de)(de)(de)概(gai)念(nian)(nian)。 但是加(jia)工(gong)(gong)(gong)微機(ji)(ji)械零(ling)件不(bu)一定非要用微型加(jia)工(gong)(gong)(gong)機(ji)(ji)床(chuang)(chuang)，例如(ru)加(jia)工(gong)(gong)(gong)儀表零(ling)件機(ji)(ji)床(chuang)(chuang)的(de)特(te)點(dian)并不(bu)是其(qi)(qi)體(ti)積(ji)有多小，而是與普通機(ji)(ji)床(chuang)(chuang)相(xiang)比精度較高。所以微機(ji)(ji)械零(ling)件的(de)機(ji)(ji)械加(jia)工(gong)(gong)(gong)設備的(de)最關鍵指標是機(ji)(ji)床(chuang)(chuang)的(de)精度，況且一味地(di)追求(qiu)減小機(ji)(ji)床(chuang)(chuang)體(ti)積(ji)只能加(jia)大成本(ben)。超精密加(jia)工(gong)(gong)(gong)技術由于其(qi)(qi)加(jia)工(gong)(gong)(gong)精度高、切(qie)削力小等特(te)點(dian)，特(te)別適合(he)進行微機(ji)(ji)械零(ling)件的(de)加(jia)工(gong)(gong)(gong)，這(zhe)也將為(wei)微機(ji)(ji)械零(ling)件的(de)加(jia)工(gong)(gong)(gong)開辟了(le)一條(tiao)新的(de)途徑。 |